Compact High-Pressure Pump for Embedded Use 'SSBL-XX Series'

High-pressure pump that can be used in areas requiring fire and explosion prevention measures due to its air-driven design.

The "SSBL-XX series" is a pump suitable for lift-off devices that remove films by high-pressure injection of pure water, IPA, NMP, etc., onto wafers and other surfaces. It can be used in locations where fire and explosion prevention measures are necessary due to its air-driven design. Fluororesin and ultra-high molecular weight polyethylene are used as sealing materials in the pressurization section. O-rings can be selected from FKM specifications or Kalrez specifications. It has been supplied to the market since 2000 for a period of 25 years. 【Features】 ■ Compact design suitable for embedding ■ Operation allows control of discharge pressure by varying air supply pressure ■ Capable of boosting pressure up to 17.6 MPa at an air pressure of 0.5 MPa (SSBL-37.5A) *For more details, please refer to the PDF materials or feel free to contact us.

basic information

【Product Specifications】 ■Size ・SSBL (common for -20A, -30A, -37.5A): W123×H116×D296.5mm ■Discharge Pressure ・SSBL-20A: 0.98～9.8MPa ・SSBL-30A: 1.47～14.7MPa ・SSBL-37.5A: 1.76～17.6MPa ■Discharge Flow Rate ・SSBL-20A: 1.13L/min ・SSBL-30A: 0.71L/min ・SSBL-37.5A: 0.58L/min ■Driving Air Pressure: 0.05～0.5MPa ■Applicable Fluids 　FKM Specification: Pure Water, IPA 　Calretz Specification: NMP ■Air Consumption: Approximately 70L (at pump stroke count of 60SPM) *For more details, please refer to the PDF document or feel free to contact us.

Price information

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Delivery Time

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Model number/Brand name

SSBL-XX Series

Applications/Examples of results

【Applications】 ■ Semiconductor cleaning equipment (jet cleaning) ■ Scrubber equipment ■ Lift-off equipment ■ Dressing of polishing pads ■ Pressure testing and so on