Continuous Slurry Supply Device P85
Achieved a cost reduction of over 15% compared to our conventional methods with a patented formulation! It can also be applied to supply uses such as catalyst slurries for fuel cells and secondary batteries!
The "Continuous Slurry Supply Device P85" is a device that supplies slurry applied during the wafer polishing process in semiconductor manufacturing. With the downsizing of the refrigeration unit and heater, the device's volume has been reduced by 61% compared to our conventional models, while the supply flow rate has increased. Additionally, the time required to supply from raw material replenishment has been significantly shortened from 52 minutes to 22 minutes compared to our conventional models. 【Features】 ■ Our unique blending method combines slurry and pure water (patent obtained) → Eliminates the need for a pump, achieving over 15% cost reduction compared to our conventional models. ■ Our proprietary heating method heats the slurry (patent obtained) → Achieves high efficiency and high response heating. *For more details about the product, please refer to the "PDF Download" button below. *Feel free to contact us with any inquiries.
basic information
【Specifications】 〇Slurry: Colloidal silica-based pH 11 〇Dilution ratio: 10, 15, 20 times 〇pH control: pH 10 to 11 ± 0.2 〇Temperature control: 20 to 40 ± 0.5℃ 〇Supply flow rate: 1.5 LPM, 0.3 MPa 〇Slurry tank: 20L built-in 〇Ammonia tank: 5L built-in 〇External dimensions: W1250*D580*H1400 〇Weight: 500 Kg
Price range
Delivery Time
Model number/Brand name
Continuous Slurry Supply Device P85
Applications/Examples of results
【Applications】 ■ Back grinder ■ CMP ■ Polish grinder ■ Grinding equipment 【Examples of Achievements】 Numerous delivery records in combination with equipment used in the semiconductor wafer polishing process.
Line up(1)
Model number | overview |
---|---|
P85 |