Notice of Participation in SEMICON Japan 2023
TECHNOVISION, INC. main office
Techno Vision Co., Ltd. is pleased to announce that we will be exhibiting at "SEMICON Japan 2023," which will be held at Tokyo Big Sight from December 13, 2023. At this exhibition, we will showcase products (concept models) aimed at contributing to the SDGs. The reference exhibits include a dicing frame used in the dicing process and a grip ring used during the expansion of chips/dies after dicing. Both products, made from new materials, are prototypes developed with the concept of contributing to plastic reduction and being environmentally friendly. In particular, the dicing frame is lightweight at 46g, which is less than one-third of the 154g of a stainless steel product. When comparing the weight of the dicing frame alone, which is 1,540kg for processing 10,000 wafers, the concept model weighs only 460kg, significantly contributing to the reduction of transportation costs. SEMICON Japan 2023 Dates: December 13 (Wed) - 15 (Fri) Booth Number: [7507] Hall 7 Location: Tokyo Big Sight
-
Date and time Wednesday, Dec 13, 2023 ～ Friday, Dec 15, 2023
10:00 AM ～ 05:00 PM
- Capital For those coming by train: ■ Rinkai Line, Kokusai-Tenjijo Station (Get off and walk about 7 minutes) ■ Yurikamome, Tokyo Big Sight Station (Get off and walk about 3 minutes)
- Entry fee Free
