"SEMICON JAPAN 2024" Review
TECHNOVISION, INC. main office
We exhibited at "SEMICON JAPAN 2024" held from December 11 (Wednesday) to 13 (Friday). Thank you very much to everyone who visited our booth. We were reminded of the strong demand for manual machines based on the valuable feedback we received from attendees. Based on this, all of our staff will strive to improve our responsiveness in the future. 《Exhibited Products on the Day》 ■ UV Film Curing Device UVC-512B ■ Film Expansion Device EXM-200 (currently under development) ■ Spring-Type Chuck / Manual Mounting Device ■ Film Application Device (Manual Mounting Device) FM-224 Series
