We will be exhibiting at "SEMICON Japan 2023."
TIP composite Co., Ltd.
TIP Composite Co., Ltd. will be exhibiting at "SEMICON Japan 2023" held at Tokyo Big Sight. At this exhibition, we will showcase a demo unit of a wafer transport device using CFRP handles, and introduce our processing technology as well as the properties of CFRP that are useful for semiconductor device components. We understand you may be busy, but we would be grateful if you could visit us. We sincerely look forward to your attendance. Venue: Tokyo Big Sight Event Dates: December 13 (Wed) to December 15 (Fri), 2023, 10:00 AM to 5:00 PM Our Booth No.: East Hall 6, Comprehensive Zone "6127" Registration is required to enter "SEMICON Japan 2023." Please register through the related link below.
Related Links
Visitor registration is required for SEMICON Japan 2023, so please register using the link.