Notice of Participation in the 'Hokuyou Bank Manufacturing Sustainability Fair'
東芝情報システム
We are pleased to announce that we will be exhibiting at the "Hokuyo Bank Manufacturing Sustainability Fair" to be held on July 22, 2026 (Wednesday) at Access Sapporo. We would like to invite you to visit us at this opportunity. <Exhibition Overview> Name: Hokuyo Bank Manufacturing Sustainability Fair Date: July 22, 2026 (Wednesday) Venue: Access Sapporo, Booth Number 86 <Exhibited Products> ■ Energy-saving Wireless Mesh Network NetNucleus LPWA We will introduce a solution that easily realizes the collection and visualization of monitoring data from manufacturing equipment using wireless devices powered by AA batteries. ■ Wind Direction and Speed IoT Sensor anemolink-2D We will showcase a wind direction and speed meter that allows for easy visualization and data collection of wind direction and speed in environments such as semiconductor clean rooms. ■ Liquid Leak Detection Algorithm Liquidseeker We will present a technology that detects liquid leaks non-contact, contributing to reduced maintenance costs by eliminating issues such as disconnection and peeling compared to traditional leak detection tape.
