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Notice of Participation in "EdgeTech+ West 2026"

東芝情報システム

東芝情報システム

We are pleased to announce that we will be exhibiting at "EdgeTech+ West 2026," which will be held at Grand Front Osaka from July 23 (Thursday) to July 24 (Friday), 2026. We sincerely invite you to visit us during this opportunity. <Exhibition Overview> Name: EdgeTech+ West 2026 Dates: July 23 (Thursday) to July 24 (Friday), 2026, 10:00 AM - 5:00 PM Venue: Grand Front Osaka, North Building, B2F, Congre Convention Center, Booth No. A-S24 <Exhibited Products> ■ Energy-efficient Mesh Network We will introduce a facility monitoring solution that easily enables equipment monitoring through battery-powered wireless mesh technology. ■ Embedded Security We will present an integrated security solution for embedded systems, looking ahead to the era of quantum computing. ■ Bluetooth Auracast We will introduce Auracast, the latest technology in Bluetooth, and provide support for the development of Bluetooth products. ■ <Reference Exhibit> AI Utilization and Image Recognition Technology and Applications We will showcase automatic annotation and AI application demos as part of AI utilization and image recognition technology.

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EdgeTech+ West 2026