Shield Soft Packing Ultra-Thin Type 'SSP-TH Series'
For applications such as protection and shielding of PDP/LDC! It has excellent conductivity in the surface and compression directions.
The "SSP-TH Series" is an ultra-thin type of shield soft packing that provides sufficient cushioning even with a thin thickness, thanks to the new material of polyolefin foam. It can be easily cut, punched, or half-cut into any shape without generating burrs or fraying during the cutting process. The through-hole sections are plated, which enhances surface conductivity and conductivity in the compression direction. 【Features】 ■ Sufficient cushioning even with a thin thickness due to the new material of polyolefin foam ■ Easy to cut, punch, or half-cut into any shape ■ No burrs or fraying during cutting ■ Plated through-hole sections ■ Excellent surface conductivity and conductivity in the compression direction *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Lineup】 ■SSP-003TH ■SSP-005TH ■SSP-007TH ■SSP-010TH *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Grounding and shielding of mobile phones ■ Protection and shielding of PDP/LCD ■ Shielding of I/O panel sections ■ Shielding of D-sub connector sections *For more details, please refer to the PDF document or feel free to contact us.
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Takeuchi Industries pursues high performance and high quality in the electronics field, responding to a wide range of customer needs. We also accommodate special products, so please feel free to contact us.