Improvement Proposal Example: Electronic Circuit Board - BGA-IC Implementation
Enabling the implementation of high-performance ICs, leading to enhanced functionality and miniaturization of the circuit board!
BGA stands for Ball Grid Array, which is an advanced package in SMT (Surface Mount Technology) implementation. BGA is a package with a structure that originated from highly evolved packaging technology in electronic engineering. Our company uses it when miniaturization and functionality enhancement are required. **Advantages of Selecting BGA-IC:** - Realization of small ICs with hundreds of pins - Ability to integrate more functions in a smaller space - Excellent electrical performance and thermal conductivity - Enables good and reliable soldering Our company possesses X-ray inspection equipment, allowing us to verify BGA implementations. Additionally, we can stably implement components such as leadless QFN and CSP.
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