Full Face Comprehensive Mask Thickness Distribution Measurement Device
Film thickness measurement goes from "point" to "surface." High-speed full-area film thickness measurement device.
The Full Face device for measuring the thickness distribution of films is a system that rapidly measures the film thickness uniformly across the entire surface of wafers or glass substrates. Its advantage lies in the ability to detect film thickness anomalies that might be overlooked in point measurements. Using a line spectroscopic camera, it measures the interference light from the film pixel by pixel along the line width. By performing a line scan across the entire diameter of the wafer, it can calculate the film thickness for each position pixel without gaps. It can measure up to 4 million points of film thickness in a short time and is capable of multilayer film analysis. There is a Dual model for both full and local measurements, and there are three camera lineups depending on the thickness of the film.
basic information
- Thin Film Measurement Model Measurement Range: 50nm to 20um (equivalent to oxide film) Applications: SiO2 films, sputtered films, resist, liquid films - Thick Film Measurement Model Measurement Range: 1um to 100um (equivalent to oxide film) Applications: Thick films and films, etc. - Ultra Thick Film Measurement Model Measurement Range: 20um to 800um (equivalent to oxide film) Applications: Wafer substrate thickness, very thick films Other high-resolution lenses, dual cameras, automatic transport, and upper communication models are available.
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Applications/Examples of results
SiO2 film, sputter film, resist, liquid film, film, measurement of wafer thickness.
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