Inspection System "Meister-SPi"
Warp compensation solution! An inspection system that combines advanced high-resolution optical components.
"Meister-SPi" is an inspection system that combines vision algorithms with advanced high-resolution optical components for the semiconductor industry. These technologies promise to deliver excellent performance, functionality, and accessibility. Additionally, the inspection capabilities of this product have already been qualified for mass production by major semiconductor foundries in Asia. 【Features】 ■ High-speed camera (12MP) and high-resolution optical system (5um) ■ Capable of inspecting thin solder (down to 10um) ■ Warpage compensation solution *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Available Packages】 ■ Fan-out Package ■ SiP ■ Flip Chip ■ WLCSP 【Specifications】 ＜Accuracy＞ ■ Calibration Jig: Height ±1µm ＜Repeatability (3α)＞ ■ Height ・ Normal substrate: 0.2µm ・ 008004 bump: 0.3µm ■ Area/Volume ・ Normal substrate: <0.3% ・ 008004 bump: <4% *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Usage】 ■Production site *For more details, please refer to the PDF document or feel free to contact us.
