Tabletop Vacuum Solder Reflow Device 'VSS-450-300'
Implementation without flux is possible through formic acid reduction. There is the advantage of not having to worry about future risks associated with the use of flux.
The main point of this device is that it enables flux-free implementation through formic acid reduction. Since flux is not used at all, there are advantages such as "no need for cleaning processes and their inspection processes" and "no need to worry about flux residues and re-corrosion caused by residues." Additionally, since flux is also a factor for voids, and formic acid weakens the surface tension of solder, it improves the removal of voids and contributes to being void-free. Furthermore, unlike conventional hydrogen reduction, formic acid reduction has a lower starting temperature for the reduction reaction than hydrogen, allowing for the removal of oxide films from substrates and electronic components without causing thermal damage.
basic information
- Compatible with loader and unloader for mass production - Supports substrates up to 300 mm x 300 mm - Maximum reaching temperature of 450℃ - Maximum heating rate of 150 K/min
Price range
Delivery Time
Model number/Brand name
Unitemp Japan Co., Ltd.
Applications/Examples of results
Industries that must prioritize safety and security, such as: - The automotive industry (power device systems, high-brightness LED systems) - The medical application industry (pacemakers, endoscopes, etc.) - The aerospace and space development industry (radars, artificial satellites, rockets, etc.) In addition to: - The functional materials development field (battery electrodes, conductive film materials, etc.) - Redox reactions on metal surfaces such as electrodes and metal powders - Redox during the sintering of silver nano and copper nano pastes (not just prevention) - Others We have seen an increase in inquiries and delivery records from many industries.
