[Coating Example] TiN Film Coating on Silicon Wafer Substrate
We would like to introduce a case that can withstand Al sputtering and anodization, and meets the specifications.
We received an inquiry from Tokyo Metropolitan University in Hachioji City regarding their desire to sputter aluminum onto silicon wafer substrates and perform anodic oxidation treatment. They are struggling because the adhesion and characteristics do not meet the required standards. They would like to confirm what changes occur by depositing a TiN film as the initial layer, but since this is a prototype-only project, other companies have declined, and they are having difficulty finding a company that can perform the deposition. It was mentioned that research on thin film electrode layers is being conducted at the university. In cases where a TiN film coating is applied to silicon wafer substrates, there are often instances where it peels off during tape tests, indicating a significant problem with adhesion. Therefore, we proposed performing a binder coat on the initial layer film to improve adhesion before applying the TiN film treatment. *For more details about the case, please refer to the related links. For further inquiries, please feel free to contact us.*
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