Implementation of 1005 support SMT bond (dispenser) nozzle
If it is difficult to apply the bond for the 1005 chip, please consider it. Customizable bond nozzles available!!
Chip components are becoming smaller, and a bonding process for 1005 components is necessary. If there are any issues with the application using a standard bonding nozzle, we will manufacture a nozzle tailored to your requirements. Our company's wire electrical discharge machining equipment allows for fine hole processing. We can accommodate requests for the inner diameter of the bond application and hole pitch. <Features> ★ Pipe inner diameter: φ0.25mm and up ★ Pipe pitch: Can be adjusted as needed. ★ Stopper: Can accommodate tip sizes and special sizes. Type for 1005: Single point application, double point application Note: Depending on the characteristics of the bond, the size of the pipe may change. Please feel free to inquire if you have any requests. *For more details, please refer to the PDF file or feel free to contact us.
basic information
<Nozzle Specifications> ★ For 1005: Special size, inner diameter φ0.30, hole pitch 0.65mm ★ For 1608: Standard size, inner diameter φ0.4, hole pitch 0.8mm Improved size, inner diameter φ0.35, hole pitch 0.7mm ★ Compatible with various manufacturers' nozzles <Material> ★ Stainless steel (SUS) *For more details, please refer to the PDF file or feel free to contact us.
Price information
Negotiable
Delivery Time
Applications/Examples of results
Part sizes: ★ For 1005 ★ For 1608 ★ For 2125 ★ For large parts - Compatible with various manufacturers' bond nozzles -
