SMT Implementation Special Nozzle (Shield, LED, Connector, IC)

Production of suction nozzles for parts with special shapes. Consistent production from design to manufacturing. If you have any issues with nozzles, please use the Tokyo factory.

■ Shield Components Problem: The components are large ○ Tip Suction Pad: Design the suction pitch according to the size of the component. Large shield components that were manually placed can now be implemented. ■ LED Problem: Surface adhesion ○ Slit Processing: By applying precision processing to the tip, adhesive components can be implemented. Reduces contact area and mitigates adhesion. Eliminates the need to carry components back. ■ Connectors Problem: Unable to suction from the top surface ○ Side Suction: Enables the implementation of components without a suction area on the top surface. Similar components with different pin counts can be suctioned using the same method. Minimum pin count: 2P and up can be produced. ■ IC Components Problem: Suction surface slips ○ Nozzle Tip: Made of urethane rubber, pad, and treated with a rough surface. Increases the friction coefficient with the component to prevent slipping. ■ Switches Problem: Protrusions hinder suction ○ Internal processing of the nozzle to avoid protrusions: Maintains vacuum and enables suction while avoiding the switch area. ■ Various Special Nozzles

basic information

【Processing Materials】 ■ Synthetic diamond, POM, urethane rubber, pads ■ Conductive zirconia ceramic, stainless steel 【Processing Methods】 ■ Processing technology for wire diameter Φ0.05 ■ Rough processing of the adsorption surface by discharge machining (Ra1.5μ～Raμ) ■ Non-stick treatment available 【Bond Nozzle】 ■ Compatible with bond nozzle 1005 (Compatible with various manufacturers) 【Maintenance Parts】 ■ Bond nozzle cleaning ■ Shaft cleaning jig ■ Circuit board cleaning jig 【Discrete Parts】 ■ Axial parts ■ Radial parts * For more details, please refer to the PDF document or feel free to contact us.