TS base partition cutter
A cutter specifically designed for substrate separation in round and blade shapes. New production, blade edge sharpening, and reprocessing are possible.
- Surface treatment increases hardness and prevents substrate debris adhesion. - Custom manufacturing is possible (blade angle modification) = extends lifespan. - Used cutters can be sharpened and reprocessed (also possible for other manufacturers' products). * We also manufacture sewing blades after shrink printing. This is listed in the product information. * For more details, please feel free to contact us.
basic information
- Can be manufactured from a thickness of 1 millimeter. - When creating new products, please consult regarding specifications such as inner and outer diameters and cutting edge angles. - For blades, we will create drawings and provide estimates based on thickness, width, and overall length information. *Surface treatment is possible depending on a certain thickness. *For more details, please feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
A dedicated cutter for splitting, designed to match the slits of the substrate. Generally used with a round blade and blade configuration. There are devices with upper and lower round blades (compatible with products from various manufacturers). *We also offer sharpening and surface treatment for cutters that can no longer cut. (In the case of reprocessing, it may not be possible to prevent warping depending on the thickness.)
