[MK/MC Case Study 8] Manufacturing Processes for Semiconductors, Printed Circuit Boards, and Electronic Components
It is possible to wipe off smudges and paste that occur on the back! It demonstrates high wipe-off performance against various types of dirt.
We would like to introduce a case study recommending the use of the "MK and MC series" handled by Toray Industries, Inc. These products can effectively wipe away smudges and paste that occur on the backside after printing with precision machinery. They utilize polyester ultra-fine fibers with a diameter of approximately 2μm. With a large contact area, they demonstrate excellent wiping performance against various types of dirt. Please feel free to consult us when you need assistance. 【Features】 ■ Made with polyester ultra-fine fibers ■ Excellent wiping performance against various types of dirt ■ High oil affinity, providing effective wiping for oily stains ■ Capable of wiping away smudges and paste that occur on the backside after printing *For more details, please refer to the PDF document or feel free to contact us.
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Usage】 ■Manufacturing processes for semiconductors, printed circuit boards, electronic components, and precision machinery. *For more details, please refer to the PDF document or feel free to contact us.
