[Case Study] ACF Tape Application Jig
Prevent adhesive defects in advance! Introducing a case where a ToshiCal S coating was applied to an ACF tape attachment jig.
At this LSI manufacturer, they had been struggling with adhesive overflow from the thermosetting epoxy resin-based adhesive applied to tapes (ACF tapes) during the production of film substrates, which caused the adhesive to stick to the fixtures. Previously, they had adopted Teflon coating, but the adhesion issues were not resolved, and they were not satisfied with its effectiveness. Therefore, they consulted with us and adopted "Toshical S TS-1310." After coating, the adhesion issues were eliminated, significantly contributing to improvements in productivity, quality, and yield. 【Overview】 ■ Customer: LSI Manufacturer ■ Target: Semiconductor substrate manufacturing process ■ Implementation: Toshical S TS-1310 *For more details, please refer to the PDF document or feel free to contact us.
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【Reference】 <Peeling force measurement data with thermosetting epoxy resin-based adhesive> ■Tosical S TS-1310: 0g ■Teflon PTFE coating: 250-300g ■SUS304 untreated: 800-900g *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company offers contract processing for surface functional modification of various substrates. Primarily, we create a dramatically non-adhesive surface by adding unevenness to surfaces that dislike adhesion, embedding special resin in the recesses while leaving it in an uneven shape. We provide non-adhesive coating "Toshical(R)S Coating Processing" and "Fine Blast Processing," which overcomes the weaknesses of sandblasting and shot blasting, allowing for uniform control of surface unevenness. Please feel free to contact us if you have any requests.