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31~36 item / All 36 items
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Heat dissipation solution
We will introduce three materials recommended by our company, starting with the "heat dissipation sheet"!
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Bearing ball (Si3N4)
The demand for ceramic balls is increasing in high-voltage EV motors!
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Active Metal Copper Circuit (AMC) Substrate
It is possible to form circuits on high-strength silicon nitride substrates. It is recommended for inverters and power module substrates.
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Heat dissipation solution "Heat Dissipation Sheet"
Widely usable between heat sources and heat dissipation plates! Heat dissipation sheet that can be attached to heat sources.
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Air circulation type ultraviolet purifier "e-pure"
Each unit can process approximately 14 tatami mats in 60 minutes! An easy-to-install air circulation type ultraviolet purifier.
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Fiber optic "Fibrance(R)"
Optical fiber that enables free designs such as bending and wrapping!
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