Sealing material / potting material
Introducing potting materials tailored to applications and environments for improving the reliability of electronic devices.
We propose "encapsulants" and "potting materials" made from resins and silicones for insulation applications in substrates and electronic components. Leveraging over 70 years of experience and a network as a specialized trading company for insulating materials, we offer a wide range of products tailored to various applications, enabling us to suggest materials and select equipment according to your specified requirements. Please consider our products with various added values to enhance the reliability of electronic devices. *For more details, please contact us via the link below. https://www.towadenki.co.jp/products/20210105-175/#at
basic information
**Features** - Sealing of electronic device circuit boards and conductive parts with insulating materials - Improvement of mechanical strength of products and acquisition of "electrical insulation," "waterproof," and "dustproof" characteristics - Enhancement of reliability of electronic devices **Typical Lineup of Potting Materials (Example)** - Epoxy - State: Liquid - Curing Condition: Two-component curing - Silicone - State: Powder (Tablet) - Curing Condition: Moisture curing - Urethane - State: Solid (Hot melt) - Curing Condition: Temperature-variable curing - Polyester - State: Solid (Tablet) - Curing Condition: UV curing *For more details, please refer to the related links or feel free to contact us.*
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Applications/Examples of results
【Usage Examples】 ■Epoxy: ECU circuit board ■Silicone: Motor (coil, winding section) ■Urethane: Inverter ■Polyester: Sensor circuit board *For more details, please refer to the related links or feel free to contact us.
