You can achieve high adhesive reliability with "no pressure" and "200°C for 1.5 hours"!

We would like to introduce the "Sintering Paste" handled by Towa Electric Co., Ltd. Compared to other sintering pastes, it can cure at low temperatures and in a short time, and since no pressure is required, it is possible to reduce the energy needed for bonding. This eco-friendly bonding material can achieve "energy savings" both in the manufacturing process of components and during the operation of EVs. 【Features】 ■ Achieves high adhesive reliability without pressure, at low-temperature sintering, and in a short time (200°C for 1.5 hours) ■ Contains 99% silver after sintering, providing high heat resistance and low electrical resistance ■ Has three times the thermal conductivity compared to conventional solder (200 W/m·K) ■ Automation solutions can also be proposed *For more details, please download the PDF or feel free to contact us.

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