Please consider various value-added encapsulants and potting materials to improve the reliability of electronic devices!

We offer proposals for "encapsulation materials and potting compounds" made from resin and silicone for insulation applications of substrates and electronic components. By sealing the mounting substrates and conductive parts of electronic devices with insulating materials, we can enhance the mechanical strength of the products and achieve "electrical insulation," "waterproof," and "dustproof" characteristics. Leveraging our experience and network as a specialized trading company for insulating materials, we handle a wide range of products tailored to specific applications, allowing us to propose materials and select equipment according to your desired specifications. 【Features】 ■ Improved mechanical strength ■ "Electrical insulation," "waterproof," and "dustproof" characteristics ■ Introduction of potting materials with added value, such as "heat dissipation characteristics" to release heat from the substrate to the surroundings, and "heat resistance characteristics" to protect the substrate from surrounding heat sources. *For more details, please download the PDF or feel free to contact us.

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