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Conductive Adhesive TCB Series

Solder alternative for aluminum components! High adhesion and low resistance! Conductive adhesive TCB series.

This is our unique conductive adhesive that uses silver-plated silica filler. [Features] 〇 Good conductivity… It adheres well to various materials and exhibits excellent conductivity. 〇 Excellent migration resistance… By reducing the amount of silver, the risk of migration is minimized. 〇 Lightweight and inexpensive… By using inorganic materials for the core, it is a lightweight material with about one-third the specific gravity compared to silver.

basic information

For detailed specifications, please refer to the published materials. In addition to the TCB series, which has excellent adhesion properties, we also offer the TCP series, which has excellent printability.

Price range

Delivery Time

Model number/Brand name

TCB / TCP Series

Applications/Examples of results

Solder, as an alternative to silver paste. [Examples of use] Conductive adhesives, die bonding materials Conductive ink applications such as for lead wiring etc.

Technical Data: Powder Coating Technology

TECHNICAL

Conductive Adhesive TCB Series

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TFM Series Introduction Document

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Technical Report: Conductive Fillers Using Powder Coating Technology

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