Release material "Sepanium" for printed circuit board manufacturing process.
Heat-resistant and gas barrier excellent release aluminum foil for printed circuit board manufacturing processes! An eco-friendly product that can also be recycled!
This is a release material that has a release film applied to an aluminum foil, which is currently used as a release material in the printed circuit board lamination process! It is available in both roll and sheet formats.
basic information
Base material aluminum foil: thickness 20 to 50 μm. Release film can be selected as single-sided coat or double-sided coat, available in clear coat and matte coat specifications. (For details, please download and refer to the catalog.)
Price range
Delivery Time
Applications/Examples of results
As a release material for printed circuit boards.
