Release material "Sepanium" for printed circuit board manufacturing process.
Heat-resistant and gas barrier excellent release aluminum foil for printed circuit board manufacturing processes! An eco-friendly product that can also be recycled!
This is a release material that has a release film applied to an aluminum foil, which is currently used as a release material in the printed circuit board lamination process! It is available in both roll and sheet formats.
basic information
Base material aluminum foil: thickness 20 to 50 μm. Release film can be selected as single-sided coat or double-sided coat, available in clear coat and matte coat specifications. (For details, please download and refer to the catalog.)
Price range
Delivery Time
Applications/Examples of results
As a release material for printed circuit boards.
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Toyo Aluminum K.K. has been pursuing the potential of aluminum's functionality and design since its founding, developing useful products and contributing to society. By accurately responding to customer needs based on the characteristics of aluminum and research outcomes, we produce foil products tailored to applications in packaging, electronics, and daily necessities, as well as powder and paste products as high-performance materials, and solar cell-related products that consider the global environment. We have grown into a manufacturer that operates globally, not only in Japan but also in Europe, the Americas, China, and other Asian countries. Moving forward, we will leverage our unique core technology as a source of development strength, under the action policy of "Creating the future, I create, we all create," to meet customer demands and contribute to the development of a new society.