Silver-plated conductive material TOYAL TecFiller TFM series
Achieve cost reduction! Fillers for conductive inks and conductive adhesives made with excellent conductivity.
TOYAL TecFiller is a unique functional filler that can impart properties such as conductivity, thermal conductivity, and insulation. Among them, the TFM series features a silver plating on the surface of relatively inexpensive core materials. As a result, it contributes to reducing costs and migration in your products compared to 100% Ag (silver) fillers. The TFM series is intended for use as a filler (filling agent) in conductive inks and conductive adhesives. 【Features】 - Uniform plating on individual particles - High conductivity performance - Core materials can be metal (copper powder) or ceramics (silicon oxide, silica powder) - Two types of particle shapes (spherical, flaky) Due to the effects of core material cost and specific gravity, it achieves significant cost-effectiveness compared to conventional silver fillers. *For details, please refer to the [supplementary materials].
basic information
〇Copper Core: Series with copper as the core material ・TFM-C05F ・TFM-C02P 〇Silica Core: Series with silica as the core material ・TFM-S02P ・TFM-S05P
Price range
Delivery Time
Applications/Examples of results
〇Applications - Conductive ink - Fillers for conductive adhesives applications
