Silver-plated conductive material TOYAL TecFiller TFM series
We apply silver plating to various core materials using our powder coating technology!
This is a conductive silver-plated filler with a silver plating applied to the surface of various core materials. Due to the low silver content, it is less prone to migration and also contributes to cost reduction. 【Features】 - Less prone to migration - Cost reduction 【Search Keywords】 #PowderCoating #SurfaceTreatmentTechnology #MultilayerCoating #HighPerformanceCoating #Plating #PowderPlating #MultilayerPlating #HighPerformancePlating
basic information
〇Copper Core: Series with copper as the core material ・TFM-C05F ・TFM-C02P 〇Silica Core: Series with silica as the core material ・TFM-S02P ・TFM-S05P
Price range
Delivery Time
Applications/Examples of results
- Conductive ink - Filler for conductive adhesive applications
catalog（7）
Download All Catalogs
Recommended products
Distributors
Toyo Aluminum K.K. has been pursuing the potential of aluminum's functionality and design since its founding, developing useful products and contributing to society. By accurately responding to customer needs based on the characteristics of aluminum and research outcomes, we produce foil products tailored to applications in packaging, electronics, and daily necessities, as well as powder and paste products as high-performance materials, and solar cell-related products that consider the global environment. We have grown into a manufacturer that operates globally, not only in Japan but also in Europe, the Americas, China, and other Asian countries. Moving forward, we will leverage our unique core technology as a source of development strength, under the action policy of "Creating the future, I create, we all create," to meet customer demands and contribute to the development of a new society.