Silver-plated conductive material TOYAL TecFiller TFM series
We apply silver plating to various core materials using our powder coating technology!
This is a conductive silver-plated filler with a silver plating applied to the surface of various core materials. Due to the low silver content, it is less prone to migration and also contributes to cost reduction. 【Features】 - Less prone to migration - Cost reduction 【Search Keywords】 #PowderCoating #SurfaceTreatmentTechnology #MultilayerCoating #HighPerformanceCoating #Plating #PowderPlating #MultilayerPlating #HighPerformancePlating
basic information
〇Copper Core: Series with copper as the core material ・TFM-C05F ・TFM-C02P 〇Silica Core: Series with silica as the core material ・TFM-S02P ・TFM-S05P
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Applications/Examples of results
- Conductive ink - Filler for conductive adhesive applications
