Achieving cost reduction for silver paste! Proposing an alternative to silver through plating.
Great news for the electronic components industry! We have achieved a significant reduction in costs by reducing the amount of silver used while ensuring conductivity, using conductive silver-plated fillers.
Silver, which is widely used in pendants, necklaces, and decorative items, has also been used for high-end tableware and spoons for a long time. Did you know that this "silver" is also extensively used in the field of electronic components? Silver is known for its excellent conductivity and is used in large quantities as a conductive filler in electronic components and as a material for solar power generation. The price of silver continues to rise, and the components that use silver are also experiencing soaring prices, leading to a strong demand for cost reduction. Our conductive silver plating filler, "TecFiller TFM Series," uses inexpensive materials such as copper and silica powder as the core material and achieves significant cost reduction by "plating silver only on the surface," ensuring conductivity while reducing the amount of silver used. The "TecFiller TFM Series" not only contributes to achieving the SDGs but also "helps our customers reduce costs."
basic information
TFM Series
Price range
Delivery Time
Applications/Examples of results
Conductive adhesive Conductive ink
