Chip component fixing adhesive Seal-glo NE series
A heating-curable epoxy adhesive that is a one-component product and has excellent storage stability. It cures quickly in a short time of 1 to 2 minutes at temperatures between 90 and 150°C.
The "Seal-glo NE series adhesive for fixing chip components" is an adhesive developed for temporarily fixing chip components. It is a one-component, heat-curing epoxy adhesive that boasts excellent storage stability. Not only does it have rapid curing properties, curing in just 1 to 2 minutes at temperatures between 90 and 150°C, which is required for SMD mounting, but it also comes in various grades that excel in high-speed dispensing and fine printing to meet your needs. Halogen-free options are also available. For more details, please download the catalog or contact us.
basic information
【Features (Excerpt from Series)】 ■NE8800K → Maintains a stable application shape with strong adhesion strength. ■NE8800T → Increased viscosity compared to NE8800K, reducing dripping and stringing. ■NE3000S → High Tg, resulting in fewer component drops in the solder bath. ■NE3300H → No spreading, excellent printability, and stable application amount even when used for thick plate printing of 3mm to 5mm thickness. ■NE7200H → A versatile adhesive that shows no stringing or spreading even when used with high-speed dispensers or thick film printing. ■NE7300H → Excellent low-temperature curing, achieving sufficient adhesion strength at 90°C for 90 seconds. For more details, please download the catalog or contact us.
Price information
For more details, please contact us.
Delivery Time
Model number/Brand name
Seal-glo NE Series
Applications/Examples of results
【Usage】 - Epoxy adhesive for fixing SMT chip components - Surface mount, thermosetting adhesive For further details, please contact us.
