Cutting processing of resin for semiconductor manufacturing
Leave the precision cutting of fixtures for semiconductor manufacturing to us.
In the semiconductor manufacturing industry, the production of jigs that require high precision and cleanliness is essential due to the handling of fine components and usage in clean rooms. Particularly, to prevent foreign matter contamination and maintain a stable production line, components with high dimensional accuracy and materials that leverage their properties are crucial. Our resin cutting processing achieves high-precision machining to meet the demands of jigs in semiconductor manufacturing. 【Usage Scenarios】 - Jigs for semiconductor manufacturing equipment - Inspection jigs - Transport jigs 【Benefits of Implementation】 - Contributes to stable operation of equipment with high precision dimensions - Reduces the risk of foreign matter contamination - Material selection that responds to diverse needs
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【Features】 - Specializes in machining small parts from finger to palm size - Compatible with a variety of engineering plastics such as Teflon, PEEK, and polyacetal - High-precision machining using NC lathes and machining centers - Precision machining under temperature-controlled conditions to minimize processing variations - Capable of machining complex shapes such as thin holes, thin parts, and small sizes 【Our Strengths】 - Supports mass production from about 10 to 10,000 units - Provides clean, high-precision products with short lead times - Proven track record in the electronics and medical fields
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Applications/Examples of results
Piping such as fittings, medical device parts, electronic device parts, semiconductor parts.
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We perform precision machining such as drilling, threading, and corner rounding on parts that are the size of a palm, using NC lathes and milling machines.