[UHS_X-ray CT System Imaging Example] Smartphone Internal Circuit Board
This is an example of a CT scan of a smartphone's internal circuit board. It is possible to observe the patterns and structures of each internal layer.
The "XVA-160αII 'Z'" is a nano-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system is an ultra-high-resolution model that achieves ultra-high magnification (2000 times) and nano-order sizes (250/800nm). The patterns of each internal layer are captured clearly. The condition of the fillet and the mounting state are also uniquely visible through CT imaging.
basic information
The XVA-160αII "Z" is a three-dimensional X-ray CT system capable of high-resolution angled CT imaging for quality assurance, failure analysis, and inspection applications in semiconductors, electronic components, and electronic modules. By utilizing functions such as fluoroscopic observation, three-dimensional angled CT, and orthogonal CT according to the application, it not only efficiently advances analysis tasks but also dramatically improves the success rate of analyses. Additionally, by using the standard program operation feature, it can also be employed for product sorting and sampling inspection purposes.
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The XVA series has been our best-selling model since its launch in 2000, widely adopted by major domestic semiconductor manufacturers, electronic component manufacturers, and EMS manufacturers. By adding orthogonal CT functionality to our core technologies, the user-centric function*1 and 3D oblique CT function, it has become versatile for a wide range of applications. #X-ray #oblique CT #transmission #non-destructive #orthogonal CT #crack #defect #void #foreign object #solder *1 User-centric function A feature that automatically follows the point of interest when performing operations such as detector tilt, stage rotation, and magnification changes during fluoroscopic observation. This is our patented technology.