Machinable thermal conductive ceramics [Shaparl Hi Msoft]
Among the easily complex and precision-machined "machinable ceramics," those that are strong, do not require molds, and can accommodate short delivery times [with thicknesses up to 60 mm available].
The main components of Shaparl® Hi Msoft are aluminum nitride (AlN) and boron nitride (BN) composite sintered materials, making it a ceramic with excellent machinability, high strength, and high thermal conductivity. Many ceramics, such as alumina, have the drawback that "processing hard sintered bodies is difficult, so green machining is often used, which leads to longer delivery times." Shaparl® Hi Msoft solves this issue by having strength comparable to alumina while also being machinable, enabling the realization of both "high strength" and "short delivery times." Particularly, since it does not require molds, it can accommodate various applications such as research purposes and development products, and can also handle complex shapes. Features: - High strength - Precision machinability (capable of handling complex shapes) - Short delivery times - High thermal conductivity - High electrical insulation - Low thermal expansion - Vacuum properties - Heat dissipation *Shaparl® is a registered trademark of Tokuyama Corporation. For detailed information, please feel free to contact us.
basic information
<<Shapal Hi-M soft Material Properties>> ♦ Thermal conductivity (92 W/m·K) ♦ Coefficient of thermal expansion (48 × 10⁻⁷/℃) *However, this is up to 400℃. ♦ Flexural strength (300 MPa) ♦ Dielectric breakdown voltage (65 kV/mm) ♦ Volume resistivity (1.0 × 10¹⁵ Ω·cm) ♦ Density (2.88 g/cm³)
Price range
Delivery Time
Model number/Brand name
H type or Shaparl Hi Msoft
Applications/Examples of results
Electronic components, heat dissipation plates, vacuum insulation materials, bearings, high-temperature nozzles, furnace fixtures.
