Thorough removal of particles with just air and no water - 'Air Screw Nozzle'
Revolutionary! No need for water washing! Particles are removed with just air blow.
<Compatible with Class 100! Can be used for cleaning semiconductors> This air nozzle utilizes a patented unique technology that significantly surpasses the air ejection power of conventional air nozzles. With powerful air blowing, it removes particles adhered to semiconductors. (Compatible with Class 100) In other words, the cleaning process that previously required three steps—1. water washing ⇒ 2. water draining ⇒ 3. drying—has been transformed. It can now be completed in one step using only "air blow" without water. This drastically shortens the process. ■ Benefit 1: Increased productivity and production volume The entire process of water washing, water draining, and drying is replaced by cleaning with air blow only. This means that water washing, water draining, and drying are no longer necessary, leading to a significant improvement in productivity and production volume. ■ Benefit 2: Improved operational efficiency and cost reduction As mentioned above, the elimination of the entire process allows for substantial cost cuts on personnel, various equipment, running costs of those equipment, electricity fees, and other expenses that were previously allocated to that process. ■ Benefit 3: Improved yield With cleaning power that is incomparable to other air nozzles, it contributes to improved yield. This helps enhance production efficiency.
basic information
■Feature 1: Rotational Waves that Generate Unmatched Power It is generally believed that strong winds can remove dust, but even with static electricity measures using an ionizer, attached dust will not be blown away. This is because dust removal capability ultimately depends on the nozzle's performance. The key is not the "strength," but the "quality." Our air nozzle processes air with rotational waves to generate cut air. This cut air produces a destructive force many times greater than that of a standard air nozzle, thoroughly blowing away even fine particles. ■Feature 2: Thorough Cleaning with Air Blow for Any Shape Our air nozzle demonstrates significant effectiveness on objects with protrusions, grooves, depressions, and uneven surfaces. The cut air generated by rotational waves excels at scraping out debris from within grooves and depressions, allowing it to reach deep into these areas and remove contaminants solely through air blow. ■Feature 3: Applicable Across All Industries Our air nozzle is compatible with Class 100 standards. It can be used not only in clean rooms for semiconductors but also in a wide range of industries that require cleaning processes. We have a proven track record of supplying many companies and factories, including major industry players.
Price information
We will provide a quote individually. Please contact us first. <By utilizing subsidies, it is possible to implement at up to half the cost.> Our company also offers support and assistance for utilizing various subsidies. Please feel free to consult with us. *The amount and rate of subsidies vary depending on the type of subsidy used and the size of the company. We will propose the most suitable option for your company, so please consult with us.
Delivery Time
Model number/Brand name
Handling Company: Pure Trust Co., Ltd.
Applications/Examples of results
【Application】 - Removal of particles adhered to semiconductors (Class 100 compatible) - Dust and chips are also removed with high cleanliness (cleanroom compatible) - Dirt and dust stuck to the workpiece are cleaned using only air blow without water With air blow from this air nozzle, stubborn dirt and adhered dust gradually come off using only air blow without water. 【Test Results from Demo Unit】 Conclusion: All debris larger than 500μm (0.5mm) was removed by air blow The dust removal test using air blow was conducted as follows: 1. Place debris in any location on the tray - Size of debris: below 20μm, 20-40μm, 40-100μm, 500μm (0.5mm) - Type of debris: airborne particles excluding adhesive types, fibers, resins, etc. 2. Check the number and location of debris under a microscope 3. Clean with air blow using the demo unit 4. Check the debris under a microscope to confirm the cleaning effect 5. Confirmed that all debris larger than 500μm (0.5mm) was removed.
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