Semiconductor inspection probe pin processing | Flexible response to prototypes, short delivery times, and custom shapes.
We manufacture probe pins for IC package and wafer inspection, accommodating prototypes, small lots, and short delivery times. We can also discuss fine shapes and sudden specification changes.
We accept requests for "probe pin processing." We assemble multiple parts, including springs, within the mold. Additionally, we have numerous achievements in producing items that may seem impossible with conventional pressing techniques, thanks to our technical expertise. 【Reasons to Choose Wako Seiki Co., Ltd.】 ■ Established a comprehensive in-house production system for press molds ■ Capable of mold production at four locations, including headquarters and mass production factories ■ Possible reduction of production lead time through load distribution ■ Stable supply of high-quality press products ■ ODM proposals leveraging high mold technical capabilities *For more details, please download our catalog or feel free to contact us.
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