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[Case Study] Reducing Plating Costs

Contributing significantly to the optimization of product costs while responding to soaring gold prices!

We would like to introduce a case where our proposed new method significantly reduced the area requiring gold plating. The customer faced a challenge where, amidst soaring gold prices, it was necessary to allow for margins in terminal design to accommodate post-plating insert molding and assembly processes. However, gold was being used in areas that were actually unnecessary, leading to plating costs exceeding expectations. To address this, we manufactured terminals while minimizing the margins and performed gold plating. After that, we implemented pitch conversion by crimping the terminals to a different band with a long pitch. This allowed us to limit the area requiring plating to the absolute minimum, significantly reducing unnecessary gold plating. 【Case Overview】 ■Challenge - Excessive plating costs due to rising gold prices. ■Effect - The proposed new method significantly reduced the area requiring gold plating. - Achieved approximately 50% reduction in gold plating costs compared to conventional methods. - Made a significant contribution to optimizing product costs while responding to rising gold prices. *For more details, please download the PDF or feel free to contact us.

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[Case Study] Reducing Plating Costs

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At Wako Seiki Co., Ltd., we design, manufacture, and sell press molds, automatic machines, and peripheral equipment. ■ Production that seems impossible with conventional presses is made possible through our technical expertise. ■ Our technical capabilities enable short delivery times, even for high-difficulty processing. Additionally, our company has obtained the "EX Passport" certification from Panasonic Corporation. Please feel free to consult us if you have any requests.