Particle-based Plasma Analysis Software 'Particle-PLUS'

"Particle-PLUS" is a plasma analysis software suitable for simulations such as plasma reaction furnaces and chemical vapor deposition (CVD).

Particle-PLUS is a plasma and rarefied fluid analysis software that uses the particle method. It is effective for research, development, and manufacturing of devices and materials using plasma. It is also capable of analyzing advanced physical models such as dual-frequency CCP and external circuit models. With comprehensive support, even those new to simulation or busy with experiments can reliably achieve results. The software employs a particle model to analyze plasma, using the PIC/MC (Particle In Cell / Monte Carlo) method to track the motion of particles representing electrons and ions. Additionally, depending on the target plasma density, it efficiently switches between implicit methods for relatively high densities and explicit methods for low densities, allowing for effective solutions even with complex models. It excels in plasma simulations of low-pressure gases, where fluid modeling is particularly challenging. In addition to standard functions for CCP, ICP, and magnetron sputtering calculations, customization to fit the customer's equipment is also available.

basic information

**Features** - The time scheme uses the implicit method, allowing for stable time evolution calculations over a large time step Δt compared to conventional methods. - The collision reaction model between neutral gas and electrons and ions employs the Monte Carlo Scattering method, enabling accurate and rapid calculations of complex reaction processes. - The neutral gas module determines the initial neutral gas distribution used in the above plasma module, allowing for quick evaluation of gas flow using the DSMC method. - The sputtered particle module calculates the behavior of atoms sputtered from the target in plasma and neutral gas environments, such as the flux distribution on the opposing substrate, which can be evaluated in a short time. - For other functions and details, please refer to the catalog.

Price range

Delivery Time

Model number/Brand name

Particle-PLUS

Applications/Examples of results

【Dual Frequency Capacitive Coupled Plasma】 - Optimization of voltage and other parameters to obtain high-density plasma - Damage to chamber walls - Optimization of power using external circuit models - It is possible to apply voltages to the electrode plates that align with real devices - The waveform of the applied voltage can be simulated smoothly and with relatively realistic voltages - Calculations are relatively stable to avoid applying unreasonable voltages 【DC Magnetron Sputtering】 - Uniformity of erosion dependent on magnetic field distribution - Adsorption distribution of sputtered materials on the substrate 【Pulsed Voltage Magnetron Sputtering】 - Optimization of the application time of pulsed voltage for efficient material sputtering 【Ion Implantation】 - The influence of the substrate on the erosion distribution 【Time Evolution of Applied Voltage on Electrode Plates】 - It is possible to observe physical quantities that are difficult to measure experimentally, such as electron density and ion velocity distribution - By investigating electron density and ion velocity distribution, it is possible to examine the uniformity of the film and damage to the chamber walls - Changing calculation conditions allows for optimization of high-density plasma generation at low power