Analysis simulation software for semiconductor-related equipment.
For simulating gas flow and thin film formation. Short computation time even for large shapes.
Our company specializes in analysis software for semiconductor-related equipment. We offer a lineup of rarefied fluid analysis software and plasma analysis software, which are effective for simulations of organic EL and magnetron sputtering. We can also accommodate customer needs. 【Product Lineup】 《Rarefied Fluid Analysis Software 'DSMC-Neutrals'》 ■ Supports unstructured meshes, allowing calculations for complex shapes ■ Capable of simulating gas flow throughout the entire equipment 《Plasma Analysis Software 'Particle-PLUS'》 ■ Enables low-pressure plasma simulations ■ Suitable for research, development, and manufacturing of devices and materials using plasma With these two systems, we can support various simulations in semiconductor manufacturing, including thin film generation, sputtering, and plasma etching. *For more details, please refer to the materials. Feel free to contact us with any inquiries.
basic information
【Other Features】 - A simulation software for dilute fluid using the particle method, useful for experiments and equipment development using vacuum chambers. - Capable of simulating film formation that includes chemical reactions such as CVD. - Adopts unstructured mesh, allowing calculations to be performed with the actual shape of the equipment. - High parallel efficiency enables quick computation results even for large-scale shapes. - Unlike fluid models, the particle method ensures convergence to a solution even with poor quality computational grids. - Comprehensive technical support ensures that even those new to simulation or busy with experiments can reliably achieve results. ◆ Outputs Various Calculation Results ◆ - Calculation of chemical reactions - Calculation of chemical reactions from Arrhenius-type reaction data - Calculation of dissociation, recombination, and molecular (atomic) exchange reactions - Ability to set multiple reaction equations on the GUI - Film deposition rate distribution - Density distribution of electrons and ions - Generation distribution of radicals and excited species - Ion flux distribution - Erosion rate distribution, etc. *For more details, please refer to the documentation. Feel free to contact us with any inquiries.
Price information
Please feel free to contact us.
Price range
P5
Delivery Time
P3
Model number/Brand name
『DSMC-Neutrals』『Particle-PLUS』
Applications/Examples of results
◆ Organic EL (OLED) Simulation * Uniformity of film deposition rate, optimization of shape, temperature dependence of organic material deposition distribution in organic EL simulation, etc. ◆ Molecular Beam Epitaxy (MBE) Simulation * Optimization of molecular beam cell shape, uniformity of deposition distribution, concentration distribution in molecular beam epitaxy simulation, etc. ◆ Showerhead-type CVD (Chemical Vapor Deposition) * Evaluation of film deposition rate * Evaluation of film uniformity * Distribution of radicals affecting film growth in the gas phase * Concentration distribution on the substrate surface * Evaluation of gas flow rate and flow volume entering the chamber from the showerhead section ◆ Vacuum Pump Exhaust Simulation * Temperature and cross-sectional area dependence of conductance, effects of gas accumulation and outgassing, etc. ◆ Behavior of Macroparticles (Dust) * Effects of macroparticles within the chamber, etc. ◆ Hypersonic Rarefied Flow * Density and temperature distribution around objects, effects of chemical reactions, etc. ◆ Shock Waves ◆ Benard Convection ◆ Behavior of Dust in the Chamber * Effects of dust on the film that need to consider gravity.
