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CCP simulation analysis software "Particle-PLUS"

"Particle-PLUS" is a plasma and rarefied fluid analysis software that excels in 2-frequency CCP analysis using the particle method.

"Particle-PLUS" is a simulation software suitable for research and development of devices using plasma, compatible with CCP. - Excels in plasma simulation for low-pressure gases where fluid modeling is challenging - Advanced physical model analysis including CCP and external circuit models - Supports 2D (two-dimensional) and 3D (three-dimensional) analysis, efficiently handling complex models - As a strength of our in-house developed software, it offers standard functions for CCP and magnetron sputtering calculations, as well as customization to fit customer devices ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD), etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us at information@wavefront.co.jp.

Related Link - http://www.wavefront.co.jp/CAE/particle-plus/

basic information

**Features** - The time scheme uses the implicit method, allowing for stable time evolution to be calculated over a large time step Δt compared to conventional methods. - The collision reaction model between neutral gas and electrons and ions employs the Monte Carlo Scattering method, enabling accurate and rapid calculations of complex reaction processes. - The neutral gas module determines the initial neutral gas distribution used in the above plasma module, allowing for quick evaluation of gas flow using the DSMC method. - The sputtered particle module calculates the behavior of atoms sputtered from the target in plasma and neutral gas in devices such as magnetron sputtering systems, enabling quick evaluation of flux distribution on opposing substrates. *For other functions and details, please feel free to contact us.*

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Model number/Brand name

Particle-PLUS

Applications/Examples of results

【Dual Frequency Capacitive Coupled Plasma】 - Optimization of voltage and other parameters to obtain high-density plasma - Damage to chamber walls - Optimization of power using external circuit models - It is possible to apply voltages to the electrode plates that align with real devices - The waveform of the applied voltage can be simulated smoothly and with relatively realistic voltages - Calculations are relatively stable to avoid applying excessive voltages 【DC Magnetron Sputtering】 - Uniformity of erosion dependent on magnetic field distribution - Adsorption distribution of sputtered materials on the substrate 【Pulsed Voltage Magnetron Sputtering】 - Optimization of the application time of pulsed voltage to efficiently sputter materials 【Ion Implantation】 - Influence of the substrate on the erosion distribution 【Temporal Changes of Applied Voltage on Electrode Plates】 - Enables observation of physical quantities that are difficult to measure experimentally, such as electron density and ion velocity distribution - By investigating electron density and ion velocity distribution, it is possible to examine the uniformity of the film and damage to the chamber walls - It is possible to optimize the generation of high-density plasma at low power by changing calculation conditions

Detailed information

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