[Example] Particle-PLUS AC Magnetron Sputtering
Introduction of analysis examples using "Particle-PLUS": "AC Magnetron Sputtering Simulation"
"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.
basic information
**Features** - The time scheme uses an implicit method, allowing for stable time evolution calculations over a large time step Δt compared to conventional methods. - The collision reaction model between neutral gas and electrons and ions employs the Monte Carlo Scattering method, enabling accurate and rapid calculations of complex reaction processes. - The neutral gas module determines the initial neutral gas distribution used in the plasma module above, allowing for quick evaluation of gas flow using the DSMC method. - The sputtered particle module calculates the behavior of atoms sputtered from the target in devices such as magnetron sputtering systems, enabling quick evaluation of flux distribution on opposing substrates. *For other functions and details, please feel free to contact us.*
Price range
Delivery Time
Model number/Brand name
Particle-PLUS
Applications/Examples of results
【Dual Frequency Capacitive Coupled Plasma】 - Optimization of voltage and other parameters to achieve high-density plasma - Damage to chamber walls - Optimization of power using an external circuit model - It is possible to apply voltages to the electrode plates that align with real devices - The waveform of the applied voltage can be simulated smoothly and with relatively realistic voltages - Calculations are relatively stable to avoid applying unreasonable voltages 【DC Magnetron Sputtering】 - Uniformity of erosion dependent on magnetic field distribution - Adsorption distribution of sputtered materials on the substrate 【Pulsed Voltage Magnetron Sputtering】 - Optimization of the application time of pulsed voltage to efficiently sputter materials 【Ion Implantation】 - The influence of the substrate on the erosion distribution 【Time Evolution of Applied Voltage on Electrode Plates】 - It is possible to observe physical quantities that are difficult to measure experimentally, such as electron density and ion velocity distribution - By investigating electron density and ion velocity distribution, it is possible to examine the uniformity of the film and damage to the chamber walls - It is possible to optimize the generation of high-density plasma at low power by changing calculation conditions.
Detailed information
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Density distribution of Ar gas
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AC Magnetron Sputtering Device Model
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Electron density distribution of the RF cycle average in a steady state.
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Ar+ ion flux on the electrode surface averaged over the RF cycle in a steady state.
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Electron temperature distribution of the RF cycle average in a steady state.
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Potential distribution of RF cycle average in steady state.
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Time evolution of the total number of plasma particles in the analysis system (e-, Ar+)
