Ester-type diamine compound "TBBAAB"
Achieving low dielectric constant through CTC suppression design makes it suitable for high-frequency applications!
"TBBAAB" is an ester-type diamine compound with a tert-butyl (t-Bu) group introduced in the second position. It features an aromatic skeleton with an ester bond in the center and amino groups at both ends, providing a structure suitable for polyimide polymerization. The rigid aromatic skeleton maintains a high glass transition temperature while improving thermoplasticity and processability. The t-Bu group introduces significant steric hindrance, suppressing the formation of intermolecular charge transfer complexes (CTC) and contributing to improved visible light transmittance. The combination of hydrophobicity and ester bonds also achieves low water absorption. **Features** - Maintains a high glass transition temperature while improving thermoplasticity and processability - Suppresses the formation of intermolecular CTC, reducing the coloring of polyimides - Achieves low water absorption through the combination of the hydrophobic t-Bu group and ester bonds - Facilitates the achievement of low dielectric constant through CTC suppression design *For more details, please download the PDF or feel free to contact us.*
basic information
【Basic Information】 ■Molecular Weight: 284.36 ■Chemical Formula: C17H20N2O2 ■((2-t-butyl-4-amino phenyl)-4-aminobenzoate) *For more details, please download the PDF or feel free to contact us.
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【Intended Uses】 ■ Transparent Polyimide (CPI) Film ■ Insulation Material for High Frequency (Low-k Layer) ■ Display and Touch Panel Substrates ■ Semiconductor Interlayer Insulation Films ■ Flexible Electronics and High-Temperature Adhesive Materials *For more details, please download the PDF or feel free to contact us.
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Our company will contribute to the next-generation industrial sector by developing new high-performance polyimide resins that respond to changing market needs. By incorporating functions not found in conventional polyimide materials (such as heat dissipation, transparency, conductivity, and adhesion) into our own polyimide products, we aim to create high-value-added polyimide materials, further stimulating the development of next-generation industrial equipment and striving to be a company that meets these demands.