Ether diamine compounds for low dielectric polyimides.
Achieves an excellent balance of heat resistance and molecular flexibility through its unique structure!
The ether-type aromatic diamine compound for low dielectric polyimides is designed for high-performance polyimide and polyester imide materials. It features a unique structure with a rigid aromatic backbone, α,α-dimethylbenzyl substituents, and para-aminophenyl end groups. This achieves an excellent balance of heat resistance and molecular flexibility. Additionally, it has balanced mechanical strength with excellent ductility and crack resistance. 【Features】 ■ Achieves high Tg ■ High transparency ■ Excellent molecular flexibility ■ Low water absorption ■ Low dielectric constant (Low-k) ■ Excellent mechanical properties *For more details, please download the PDF or feel free to contact us.
basic information
【Basic Information】 ■Molecular Weight: 528.68 ■Chemical Formula: C36H36N2O2 ■1,3-bis[4-(4-aminophenoxy)-α,α-dimethylbenzyl]benzene *For more details, please download the PDF or feel free to contact us.
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【Main Applications】 ■ Insulation layer for high frequency (Low-k materials) ■ Interlayer dielectric film for semiconductors (ILD) ■ Flexible electronic devices ■ High heat-resistant adhesives *For more details, please download the PDF or feel free to contact us.
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Our company will contribute to the next-generation industrial sector by developing new high-performance polyimide resins that respond to changing market needs. By incorporating functions not found in conventional polyimide materials (such as heat dissipation, transparency, conductivity, and adhesion) into our own polyimide products, we aim to create high-value-added polyimide materials, further stimulating the development of next-generation industrial equipment and striving to be a company that meets these demands.