Precision machining case study of insert components for resin molds <HPM31> [Semiconductor industry]

The material used is HPM31 SKD61, and the processing and treatment are carried out using EDM wire and die-sinking discharge. This is a manufacturing example for the semiconductor industry.

WTM Corporation has a track record of sourcing precision machined parts of Japanese quality from overseas for 18 years. We respond with sincerity to "a variety of products, from one piece," managing everything from procurement sources to processes and inspections in a comprehensive manner. This time, we would like to introduce a case study of the production of insert parts for resin molds used in the semiconductor industry. The material used is HPM31 SKD61, and the processing and treatment are carried out using EDM wire and die-sinking electrical discharge machining. 【Project Overview】 - Product Name: Insert Parts for Resin Molds - Material: HPM31 SKD61 - Size: 27×3×49.5mm - Processing and Treatment: EDM Wire and Die-Sinking Electrical Discharge - Industry: Semiconductor < WTM Supporting Solutions for Manufacturing Challenges > For more details, please view our company brochure by clicking "Download Catalog" below, or feel free to contact us.

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