Precision Machining Case Study of Molding Punches in the Semiconductor Industry

Processing and treatment are carried out using mirror surface type electric discharge machining. Examples of production for the semiconductor industry.

WTM Corporation has a track record of sourcing precision machined parts of Japanese quality from overseas for 18 years. We respond with sincerity to "a variety of products, starting from one piece," and manage everything from procurement sources to processes and inspections in a comprehensive manner. This time, we would like to introduce a case study of manufacturing a punch for molding used in the semiconductor industry. The processing and treatment were carried out using mirror-finished electric discharge machining. The size is 27×25×20mm, and the materials used are SKD11 and SKD61. 【Project Overview】 - Product Name: Punch for Molding - Material: SKD11 SKD61 - Size: 27×25×20mm - Processing and Treatment: Mirror-finished electric discharge machining - Industry: Semiconductor < WTM Supporting Solutions for Manufacturing Challenges > For more details, please view our company brochure by clicking "Download Catalog" below, or feel free to contact us.

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