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PCIe board for high-speed inkjet printing and multi-head control.

High-speed label printer that changes the design with each print, one-pass super wide color printer (up to 40 heads), high-speed large 3D printer.

High-speed label printer that changes designs with each print. The GEN5 can change and print designs of 100mm in length at a rate of 12 types per second, with a printing speed of 72m/min. Compatible with various heads: Kyocera, Dimatix, Konica Minolta, and others. Single-pass ultra-wide color printer (up to 40 heads). For high-speed, large 3D printers.

http://www.y-drive.biz/DPN_Head.html

basic information

PCIe x1 GEN2 High-Speed DMA Transfer - 350MB/second Equipped with "1GB Memory" on board *Up to 10 heads can be connected to a single PCIe board *Data can be transferred at 20MB/second for each head *Printing mechanism and encoder synchronization control function *Fire signal generation from encoder signal *Up to 4 boards can be inserted into computer slots *Compatible with devices using 10 heads for each CMYK color *Printing control software, Bitmap data compatible *Available via DLL (C#, C++)

Price information

List price: 850,000 yen Prices vary depending on quantity.

Price range

P4

Delivery Time

OTHER

Feel free.

Model number/Brand name

High-speed PCIe control board

Applications/Examples of results

High-speed inkjet printer High-speed label printer that changes the design with each print The GEN5 can change and print designs of 100mm in length at a rate of 12 types per second, with a printing speed of 72m/min Compatible with various heads: Kyocera, Dimatix, Konica Minolta, and others Single-pass ultra-wide color printer (up to 40 heads) For high-speed, large-format 3D printers

PCIe board for high-speed inkjet printing and multi-head control.

PRODUCT

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Distributors

Y-Drive Co., Ltd. is a company that develops and researches printed electronics technology. In addition to the production of electronic devices using inkjet methods, micro-nano molding methods, and printing methods, we also undertake the fabrication of fine 2D and 3D printed wiring/structures (fabrication of structures at scales below a few micrometers) and the development of various electronic circuit boards. We also accept contracts for various image processing software (camera systems and 3D sensor systems), FPGA design, electronic control software development, and embedded electronic device development.