[Wafer Transport Robot E Series] Features a proprietary DD motor, known for high precision and high rigidity. Compatible with 2-12 inch wafers. Designed with minimal aging degradation without gears, and fewer parts reduce maintenance effort. Achieves a balance of high performance and affordability, and can also accommodate custom applications for transporting PCBs and glass substrates, beyond just wafer transport. The transport axis of the robot itself can also be proposed according to specifications.

【Wafer Aligner HPA Series】 The HPA series of wafer aligners features a 3-axis control system, utilizing HIWIN's single-axis robot module to achieve high speed, high precision, high rigidity, high efficiency, and space-saving design. With an all-in-one design of the built-in controller, there is no need for external controller placement or wiring space. Equipped with an intelligent transparent laser sensor, it can detect the contours of objects that are transparent, translucent, and opaque. It can accommodate wafers and glass with diameters ranging from a minimum of 2 inches to a maximum of 12 inches. - Lineup supporting 2-12 inches - Wafer alignment possible in as little as 4.9 seconds - Simultaneous correction of wafer center and angle, achieving a repeatability accuracy of ±0.1 mm - Cleanliness Class 1

【Wafer Load Port HLP Series】 The HLP series is a shared load port designed for the handling of 8-inch and 12-inch products. It directly accommodates 8-inch and 12-inch FOUP/FOSB. Options for applicable adapters are available for 8-inch open cassettes and 12-inch metal carriers. - Directly compatible with 8-inch and 12-inch FOUP/FOSB. - Product cleanliness is Class 1. - In compliance with relevant safety regulations, the system provides an emergency stop function. It monitors various functional modules such as electrical control systems, sensing systems, and vacuum systems in real-time. - All major components of the wafer load port, including ball screws and linear guideways, are developed and manufactured in-house.

【Ultra-thin DD Motor DMT Series】 One of the thinnest in the industry, with a thickness of 22mm. The overwhelming thinness and large hollow diameter allow for a space-saving rotation mechanism, increasing the design flexibility for installation! Starting from June 2023, we have begun accepting orders and sales for the new "DMTK3" with a hollow diameter of 340mm and a thickness of 30mm. - Ultra-thin designs of 22mm and 30mm - Large hollow shaft - High resolution with excellent positioning accuracy - Gearless with zero backlash - High torque achieved through a unique magnetic circuit design

【Miniature Linear Guideway MG Series】 Ideal for the semiconductor industry and small devices! Compact, lightweight, and made of stainless steel. Features a gothic arch groove design that provides high rigidity and precision in all directions. Its compact and lightweight nature makes it suitable for small devices. Due to the gothic arch contact design, it is characterized by high rigidity and precision in all directions. Available in two types with different rail widths: "MGN" and "MGW." The MGW series has a wide design, allowing for a greater moment load capacity.