Soldering Masking Jig Solder Palette
Masking transport fixtures (pallets, carriers) in the soldering process of printed circuit boards.
Features - Minimal warping at high temperatures allows for uniform soldering to the substrate. - Prevents damage to mounted components due to static electricity measures. - Shortens the soldering process for double-sided mounting, preventing human errors from masking with heat-resistant tape or hand soldering. - Masking work can be omitted. - By keeping the rail width of the mounting device constant, it eliminates the hassle of changing the rail width for each substrate. - Excellent heat resistance and compatible with lead-free solder. - Lightweight compared to aluminum and titanium, reducing the burden on workers and improving work efficiency. - If you provide the drawings or data for the pallet, the drawings or data for the printed circuit board, Gerber data, or the actual printed circuit board, we will design and manufacture the pallet. - The material is a composite of glass fiber and resin.
basic information
Physical Properties Maximum Operating Temperature: 300℃ Solder Heat Resistance Temperature: 260℃ OK for 10 minutes Solder Heat Resistance Temperature: 300℃ OK for 5 minutes Thermal Decomposition Temperature (1% reduction): 227℃ Thermal Decomposition Temperature (5% reduction): 288℃ Thermal Decomposition Temperature (10% reduction): 328℃ Glass Transition Temperature: 174℃ Coefficient of Thermal Expansion (parallel to layer): 7.1×10^-6 K^-1 Coefficient of Thermal Expansion (perpendicular to layer): 20.5×10^-6 K^-1 Thermal Conductivity: 0.31 W/m·k Flammability: UL94HB Tensile Strength (25℃): 240 MPa Tensile Strength (130℃): 200 MPa Tensile Strength (150℃): 170 MPa Tensile Modulus (25℃): 17200 MPa Flexural Strength (25℃): 370 MPa Flexural Strength (130℃): 170 MPa Flexural Strength (150℃): 170 MPa Flexural Modulus (25℃): 16500 MPa Compressive Strength (25℃, perpendicular to layer): 610 MPa Compressive Strength (25℃, parallel to layer): 260 MPa Izod Impact Strength: 8.1 J/cm Barcol Hardness: 77 Electrostatic Discharge Safety: Yes Density: 1.84 Water Absorption Rate: Below 0.2% The values listed are measured values and not guaranteed values.
Price information
It varies depending on the content and quantity, so please contact us.
Delivery Time
Applications/Examples of results
Fixtures for transporting printed circuit boards in the soldering process of printed circuit boards (solder pallets, masking fixtures, carriers)
