Soldering Masking Jig Solder Palette
Masking transport fixtures (pallets, carriers) in the soldering process of printed circuit boards.
Features - Minimal warping at high temperatures allows for uniform soldering to the substrate. - Prevents damage to mounted components due to static electricity measures. - Shortens the soldering process for double-sided mounting, preventing human errors from masking with heat-resistant tape or hand soldering. - Masking work can be omitted. - By keeping the rail width of the mounting device constant, it eliminates the hassle of changing the rail width for each substrate. - Excellent heat resistance and compatible with lead-free solder. - Lightweight compared to aluminum and titanium, reducing the burden on workers and improving work efficiency. - If you provide the drawings or data for the pallet, the drawings or data for the printed circuit board, Gerber data, or the actual printed circuit board, we will design and manufacture the pallet. - The material is a composite of glass fiber and resin.
basic information
Physical Properties Maximum Operating Temperature: 300℃ Solder Heat Resistance Temperature: 260℃ OK for 10 minutes Solder Heat Resistance Temperature: 300℃ OK for 5 minutes Thermal Decomposition Temperature (1% reduction): 227℃ Thermal Decomposition Temperature (5% reduction): 288℃ Thermal Decomposition Temperature (10% reduction): 328℃ Glass Transition Temperature: 174℃ Coefficient of Thermal Expansion (parallel to layer): 7.1×10^-6 K^-1 Coefficient of Thermal Expansion (perpendicular to layer): 20.5×10^-6 K^-1 Thermal Conductivity: 0.31 W/m·k Flammability: UL94HB Tensile Strength (25℃): 240 MPa Tensile Strength (130℃): 200 MPa Tensile Strength (150℃): 170 MPa Tensile Modulus (25℃): 17200 MPa Flexural Strength (25℃): 370 MPa Flexural Strength (130℃): 170 MPa Flexural Strength (150℃): 170 MPa Flexural Modulus (25℃): 16500 MPa Compressive Strength (25℃, perpendicular to layer): 610 MPa Compressive Strength (25℃, parallel to layer): 260 MPa Izod Impact Strength: 8.1 J/cm Barcol Hardness: 77 Electrostatic Discharge Safety: Yes Density: 1.84 Water Absorption Rate: Below 0.2% The values listed are measured values and not guaranteed values.
Price information
It varies depending on the content and quantity, so please contact us.
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Fixtures for transporting printed circuit boards in the soldering process of printed circuit boards (solder pallets, masking fixtures, carriers)
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Our company is a manufacturer specializing in the processing of resins, ceramics, and insulation materials. We receive drawings from customers, procure materials either in-house or supplied by customers, and use machining centers, NC lathes, and other machine tools to process various resins, ceramics, and insulation materials, producing components for the manufacturing industry, such as machine parts and electrical insulation parts. The main features are as follows: 1. While we handle a wide range of resins, ceramics, and insulation materials, we particularly excel in processing materials that are difficult to work with, such as: (1) Composite materials of resin with glass fiber or carbon fiber (FRP, GFRP, CFRP) (2) Insulation and heat-resistant materials (rigid insulation boards primarily made from glass fiber, cement, mica, etc.) (3) Ceramics (4) Carbon 2. Since we deal with a wide range of resins, ceramics, and insulation materials, we can supply most materials. 3. With various machines such as machining centers, NC lathes, grinders, and gear cutting machines, we can manufacture most shapes. 4. We can accommodate production quantities ranging from one piece to 50,000 pieces. 5. We keep a stock of materials, allowing for short lead times. 6. We understand the characteristics of various resins, ceramics, and insulation materials, enabling us to select the optimal material according to requirements. 7. We can ship nationwide.