New products added to the YXLON product portfolio for the semiconductor industry.
Comet Technologies Japan K.K. Comet Yxlon
A new X-ray inspection device specialized for the semiconductor industry has been announced by Exelon International (hereafter YXLON) of the Swiss Comet Group. This device features the latest 2D/3D automatic inspection capabilities, allowing it to identify and measure defective areas, including adhesive failures and misalignments. It achieves the highest resolution in the world. The YXLON FF70CL was introduced at SEMICON China held in Shanghai from March 20 to 22, 2019. The FF70CL and FF65CL series are equipped with the ability to detect, magnify, and automatically analyze extremely small semiconductor defects with ultra-high resolution. These latest inspection devices can also perform automatic analysis of TSVs, C4 bumps, 3D packages, MEMS, and more. The FF65IL, a jointly developed product with Nagoya Electric Works, is designed to enable 100% inspection while maintaining high precision. "In the case of inspecting complex 3D packages, existing inspection methods have limitations," says Eike Frühbrodt, Vice President of YXLON Product and Project Management. "The FF70CL, with its oblique CT function, high-precision air-suspended manipulator, vibration-resistant structure, and a machine weight of 7 tons, optimizes defect inspection at the micron level."
Related Links