TST Wafer Supply Taping Device
Introduction to the automatic taping device for wafer ring supply type electrical appearance inspection!
We would like to introduce the "TST Wafer Supply Taping Device" that we handle. This device automatically tapes wafer-level CSP or substrate-type MCMs, which are attached to an 8-inch wafer ring, after cutting them into individual pieces using a picker unit, followed by electrical testing and visual inspection. The electrical testing can be customized (O/S function tests, withstand voltage tests, etc.), and the taping is done using embossed taping. 【Specifications (partial)】 ■ Supply form: 8-inch wafer ring ■ Supply method: 8-inch wafer cassette for 25 pieces ■ Picker method: bottom push-up, top suction PP transport ■ Electrical testing: customizable (O/S function tests, withstand voltage tests, etc.) *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Other Specifications】 ■Appearance Inspection - Bottom surface (terminal shape, inspection for large chips and cracks, etc.) - In-pocket (direction, front and back confirmation, character inspection, etc.) ■Taping: Embossed Taping *For more details, please refer to the PDF document or feel free to contact us.
Price range
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
