Release agent for cured epoxy resin 'eSolv 21AM-1'
Dissolution and peeling of cured epoxy resin and laminated lenses are possible! Exceptional dissolving power for cured resin! The effect is even greater when heated!
The "eSolve 21AM-1" is a powerful epoxy-based resin release agent (solvent). It removes resin by dissolving or causing slight swelling, leading to flaking and separation. It is also effective on urethane-based resins. Additionally, there has been an increase in inquiries from the lens industry. Features: - Dissolution and removal of epoxy and urethane resins - Processing of workpieces that can only be separated by physical force - Reduction of working time - Performance significantly improves with heating - Particularly effective at temperatures above 80°C - Many proven results in lens separation - Numerous successful cases of ink removal from lens coatings - Proven results in retrieving samples after SEM observation *For more details, please refer to the catalog. Feel free to contact us with any inquiries.
basic information
- Boiling point: 205–210°C - pH: 12.5–14.0 - Flash point: 107°C - Solubility in water: Water-soluble liquid
Price range
Delivery Time
Model number/Brand name
eSolve 21AM-1
Applications/Examples of results
- Epoxy resin dissolution - Lens delamination - Removal of optical element coatings *We also accept commissioned tests for dissolution using resin solvents for the analysis of electrical and electronic components (such as substrates). (Negotiable)*
Related Videos
Line up（1）
| Model number | overview |
|---|---|
| eSolve 21HEK | Proven performance in the removal and dissolution of epoxy resin |
