Addressing technical challenges associated with substrate multilayering! We will introduce examples of utilizing quality issues.

We will introduce examples of utilizing quality issues. With the improvement of performance in semiconductors and communication devices, manufacturing and inspection equipment has also become more advanced. Sufficient quality could not be ensured at external subcontractors, which limited design flexibility and became a factor hindering competitiveness. Through our efforts in developing implementation technologies that maximize our customers' design flexibility, we have kept pace with high multilayering and high density. Furthermore, in response to customer requests, we are promoting technological development aimed at realizing special components and specifications, contributing to the enhancement of design flexibility. We have achieved an improvement in the competitiveness of our customers' products. Other examples of utilization are also introduced on the external link page. 【Example】 ■ Supported substrate size: 610×600mm ■ Board thickness: Up to 10mm ■ Weight: Up to 10kg ■ Types of special components: BGA, LGA, CCGA, QFN, press-fit connectors ■ Minimum chip: 0402 *For more details, please refer to the external link page or feel free to contact us.

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