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[Case Study] How to reduce damage to pickups?

Improvement of damage defects such as microcracks! Leave it to us with our pickup tools.

We would like to introduce a case of defect improvement in the transfer process of sensor chips that we proposed. In the process of transferring indium phosphide and gallium arsenide sensor chips to the inspection stage, defects due to cracks and micro-cracks were occurring. Due to the fragility of the material, the challenge was to create a pickup collet that would minimize damage. When we replaced the conventional very hard carbide collet with a rubber collet, the occurrence of cracks and micro-cracks was eliminated, resulting in zero defects. [Case Study] ■ Issues - Defects due to cracks and micro-cracks were occurring at a rate of 50%. - A damage-minimizing pickup collet was needed due to the fragility of the material. - The transport speed of the transfer device was set to the slowest speed, but no improvement was observed. ■ Proposal - Replaced the carbide collet with a rubber collet. - The occurrence of cracks and micro-cracks was eliminated, resulting in zero defects. *For more details, please refer to the PDF document or feel free to contact us.

Related Link - http://www.orute-corp.co.jp/

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【Proposed Product】 - Rubber Collet *For more details, please refer to the PDF document or feel free to contact us.

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For more details, please refer to the PDF document or feel free to contact us.

Orte Corporation General Catalog

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[Case Study Collection] Solutions to Challenges in Semiconductor Manufacturing Equipment in the Backend Process

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Precision nozzle, dispense tool, needle stage

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